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Fri, 19 December 2014.
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Jong Jin Lee

Daejeon KR

Patent Applications

Pub DatePub NumberApp NumberApp DateTitle
2012-07-0520120168212133084392011-11-30PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
2011-09-2220110227228128869272010-09-21FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
2009-01-2920090027864120076872008-01-14Printed circuit board and manufacturing method thereof
2008-03-2720080073025115244012006-09-21Method of manufacturing copper-clad laminate for VOP application
2007-12-2720070298546117850932007-04-13Manufacturing method package substrate
2007-09-0620070207607117438222007-05-03BALL GRID ARRAY SUBSTRATE HAVING WINDOW AND METHOD OF FABRICATING SAME