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Patent Applications

Pub DatePub NumberApp NumberApp DateTitle
2008-01-3120080022506116939922007-03-30METHOD FOR PRODUCTION OF A SUPERCONDUCTING MAGNETIC COIL, AND MR APPARATUS HAVING SUCH A COIL
2008-01-3120080023056115965172005-05-19Thermoelectric Conversion System and of Increasing Efficiency of Thermoelectric Conversion System
2008-01-3120080023057116644212005-11-01Thermoelectric Conversion Module, and Thermoelectric Power Generating Device and Method, Exhaust Heat Recovery System, Solar Heat Utilization System, and Peltier Cooling and Heating System, Provided Therewith
2008-01-3120080023058118806312007-07-23Thermoelectric conversion device and manufacture method for the same
2008-01-3120080023059118283172007-07-25TANDEM SOLAR CELL STRUCTURES AND METHODS OF MANUFACTURING SAME
2008-01-3120080023060115706932005-06-06Apparatus for Distributing Light Energy Particularly for Photovoltaic Conversion
2008-01-3120080023061118819572007-07-30Reflector assemblies, systems, and methods for collecting solar radiation for photovoltaic electricity generation
2008-01-3120080023062110299022005-01-04Holographic imaging passive tracking solar energy filter, concentrator and converter with PV cell cooling means
2008-01-3120080023065114922772006-07-25Thin film photovoltaic module wiring for improved efficiency
2008-01-3120080023066116784042007-02-23TRANSPARENT ELECTRODES FORMED OF METAL ELECTRODE GRIDS AND NANOSTRUCTURE NETWORKS
2008-01-3120080023067116989952007-01-29Solar cell with nanostructure electrode
2008-01-3120080023068118267192007-07-18Solar cell module
2008-01-3120080023069118293492007-07-27PHOTOVOLTAIC ELEMENT AND FABRICATION METHOD THEREOF
2008-01-3120080023070118815012007-07-26Methods and systems for manufacturing polycrystalline silicon and silicon-germanium solar cells
2008-01-3120080023134118788232007-07-27Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods
2008-01-3120080023139115121162006-08-30Plasma processing apparatus and plasma processing method
2008-01-3120080023143118818012007-07-27Capacitively coupled plasma reactor with magnetic plasma control
2008-01-3120080023144117780582007-07-15DIELECTRIC ETCH TOOL CONFIGURED FOR HIGH DENSITY AND LOW BOMBARDMENT ENERGY PLASMA PROVIDING HIGH ETCH RATES
2008-01-3120080023145118658362007-10-02PLASMA PROCESSING APPARATUS AND METHOD
2008-01-3120080023147115120812006-08-30Plasma processing apparatus
2008-01-3120080023219118784522007-07-24Electronic component and method for manufacturing same
2008-01-3120080023623118698182007-10-10System and Method for A High Dynamic Range Sensitive Sensor Element Array
2008-01-3120080023657118803192007-07-20Extreme ultraviolet light source
2008-01-3120080023685117434592007-05-02MEMORY DEVICE AND METHOD OF MAKING SAME
2008-01-3120080023686118223192007-07-05Storage nodes, phase change memories including a doped phase change layer, and methods of operating and fabricating the same
2008-01-3120080023687115993912006-11-15Light emitting device and method of manufacturing the same
2008-01-3120080023688117359932007-04-16EFFICIENT CARRIER INJECTION IN A SEMICONDUCTOR DEVICE
2008-01-3120080023689118786412007-07-25Nitride-based light emitting device
2008-01-3120080023690118786422007-07-25Nitride-based light emitting device
2008-01-3120080023691118983682007-09-11Light emitting diode having vertical topology and method of making the same
2008-01-3120080023692116889462007-03-21TRANSISTOR HAVING A STRAINED CHANNEL REGION INCLUDING A PERFORMANCE ENHANCING MATERIAL COMPOSITION
2008-01-3120080023693112260272005-09-14Methods, devices and compositions for depositing and orienting nanostructures
2008-01-3120080023694114920802006-07-25Display device and method of manufacturing the same
2008-01-3120080023695117829802007-07-25ORGANIC THIN FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
2008-01-3120080023696118262272007-07-13Memory element and semiconductor device
2008-01-3120080023697118289712007-07-26ORGANIC THIN FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
2008-01-3120080023698114953452006-07-28Device having zinc oxide semiconductor and indium/zinc electrode
2008-01-3120080023699114602092006-07-26A TEST STRUCTURE AND METHOD FOR DETECTING CHARGE EFFECTS DURING SEMICONDUCTOR PROCESSING
2008-01-3120080023700114607512006-07-28SCAN TESTING IN SINGLE-CHIP MULTICORE SYSTEMS
2008-01-3120080023701118295442007-07-27TEST MODULE FOR SEMICONDUCTOR DEVICE
2008-01-3120080023702118786972007-07-26Integrated circuit module and method of forming the same
2008-01-3120080023703114967682006-07-31System and method for manufacturing a thin-film device
2008-01-3120080023704117827012007-07-25Display Device and Fabrication Method Thereof
2008-01-3120080023705118293322007-07-27THIN-FILM TRANSISTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY PANEL HAVING THE SAME
2008-01-3120080023706117829142007-07-25NITRIDE SEMICONDUCTOR DEVICE
2008-01-3120080023707114936042006-07-27Semiconductor device and method of producing the semiconductor device
2008-01-3120080023708118632202007-09-27Semiconductor Light-Emitting Device and Method of Manufacturing Semiconductor Light-Emitting Device
2008-01-3120080023709117988732007-05-17Semiconductor light-emitting device and method of fabricating the same
2008-01-3120080023710118268742007-07-19Method of growing a nitride single crystal on silicon wafer, nitride semiconductor light emitting diode manufactured using the same and the manufacturing method
2008-01-3120080023711114969222006-07-31Light emitting diode package with optical element
2008-01-3120080023712116230682007-01-13Phosphor Converted Light Emitting Device
2008-01-3120080023713116641812005-09-29Package for Housing Light-Emitting Element and Method for Manufacturing Package for Housing Light-Emitting Element
2008-01-3120080023714116976382007-04-06SURFACE MOUNTING DEVICE-TYPE LIGHT EMITTING DIODE
2008-01-3120080023715117800822007-07-19Method of Making White Light LEDs and Continuously Color Tunable LEDs
2008-01-3120080023716118269032007-07-19Semiconductor combined device, light emitting diode head, and image forming apparatus
2008-01-3120080023717118282522007-07-25DISPLAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY DEVICE HAVING THE SAME
2008-01-3120080023718118613782007-09-26LED LAMP
2008-01-3120080023719118689032007-10-08Light Emitting Devices with Improved Light Extraction Efficiency
2008-01-3120080023720115312342006-09-12Light Emitting Diode Lighting Module with Improved Heat Dissipation Structure
2008-01-3120080023721115751282005-06-23Light Emitting Diode Package Having Multiple Molding Resins
2008-01-3120080023722118782732007-07-23Light-emitting heat-dissipating device and packaging method thereof
2008-01-3120080023723114602502006-07-27LED Lighting Device
2008-01-3120080023724119023412007-09-20Light emitting element, light emitting device having the same and method for manufacturing the same
2008-01-3120080023725114958112006-07-28Process for manufacturing epitaxial wafers for integrated devices on a common compound semiconductor III-V wafer
2008-01-3120080023726118058552007-05-24Schottky gate metallization for semiconductor devices
2008-01-3120080023727118783742007-07-24Field effect transistor having its breakdown voltage enhanced
2008-01-3120080023728118686482007-10-08Semiconductor Integrated Circuits With Stacked Node Contact Structures
2008-01-3120080023729118787252007-07-26Solid-state image sensor
2008-01-3120080023730118899192007-08-17Imaging apparatus and a device for use therewith
2008-01-3120080023731114961202006-07-31Three-dimensional cascaded power distribution in a semiconductor device
2008-01-3120080023732118294382007-07-27USE OF CARBON CO-IMPLANTATION WITH MILLISECOND ANNEAL TO PRODUCE ULTRA-SHALLOW JUNCTIONS
2008-01-3120080023733118603622007-09-24FABRICATION METHODS FOR COMPRESSIVE STRAINED-SILICON AND TRANSISTORS USING THE SAME
2008-01-3120080023734117810192007-07-20MICROLENSES OF CMOS IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME
2008-01-3120080023735118673342007-10-04LIGHT SENSING ELEMENT, ARRAY SUBSTRATE HAVING THE SAME AND LIQUID CRYSTAL DISPLAY APPARATUS HAVING THE SAME
2008-01-3120080023736118286882007-07-26Semiconductor Device and Method for Manufacturing the Same
2008-01-3120080023737118783842007-07-24Image sensor and method for manufacturing the same
2008-01-3120080023738114946882006-07-28Silicon microlens array
2008-01-3120080023739117791712007-07-17METHOD OF MANUFACTURING A SEMICONDUCTOR WAFER COMPRISING AN INTEGRATED OPTICAL FILTER
2008-01-3120080023740114966912006-07-31Novel capping layer for a magnetic tunnel junction device to enhance dR/R and a method of making the same
2008-01-3120080023741117158802007-03-09Nonvolatile ferroelectric memory device using silicon substrate, method for manufacturing the same, and refresh method thereof
2008-01-3120080023742115851062006-10-24Semiconductor device with a surrounded channel transistor
2008-01-3120080023743119050022007-09-27Semiconductor memory device and manufacturing method of the same
2008-01-3120080023744117230812007-03-16Nonvolatile semiconductor memory device and method of manufacturing the same
2008-01-3120080023745118660472007-10-02METHODS OF FORMING CAPACITORS FOR SEMICONDUCTOR MEMORY DEVICES AND RESULTING SEMICONDUCTOR MEMORY DEVICES
2008-01-3120080023746118815622007-07-27Semiconductor devices having dielectric layers and methods of forming the same
2008-01-3120080023747117772932007-07-13SEMICONDUCTOR MEMORY DEVICE WITH MEMORY CELLS ON MULTIPLE LAYERS
2008-01-3120080023748114950082006-07-27Self-aligned contacts to source/drain regions
2008-01-3120080023749117242902007-03-15Non-volatile memory device and methods of operating and fabricating the same
2008-01-3120080023750114614282006-07-31MEMORY CELL SYSTEM WITH MULTIPLE NITRIDE LAYERS
2008-01-3120080023751114611312006-07-31INTEGRATED CIRCUIT MEMORY SYSTEM EMPLOYING SILICON RICH LAYERS
2008-01-3120080023752114607662006-07-28BORON DOPED SiGe HALO FOR NFET TO CONTROL SHORT CHANNEL EFFECT
2008-01-3120080023753116187732006-12-30SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
2008-01-3120080023754118194292007-06-27Semiconductor device with a wave-shaped trench or gate and method for manufacturing the same
2008-01-3120080023755118198582007-06-29Semiconductor device and method for fabricating the same
2008-01-3120080023756118810352007-07-24Semiconductor device and fabricating method thereof
2008-01-3120080023757118225912007-07-09Semiconductor device having fin-field effect transistor and manufacturing method thereof
2008-01-3120080023758118635562007-09-28SEMICONDUCTOR DEVICE
2008-01-3120080023759118660722007-10-02LOW VOLTAGE HIGH DENSITY TRENCH-GATED POWER DEVICE WITH UNIFORMLY DOPED CHANNEL AND ITS EDGE TERMINATION
2008-01-3120080023760115809612006-10-16Semiconductor device with increased breakdown voltage
2008-01-3120080023761118196062007-06-28Semiconductor devices and methods of fabricating the same
2008-01-3120080023762118819422007-07-30Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology
2008-01-3120080023763118804842007-07-19Threshold-voltage trimming of insulated-gate power devices
2008-01-3120080023764119029962007-09-27Semiconductor memory device and manufacturing method of the same
2008-01-3120080023765117561222007-05-31Semiconductor Devices and Methods of Fabricating the Same
2008-01-3120080023766114596502006-07-25 ELECTROSTATIC DISCHARGE PROTECTION DEVICE
2008-01-3120080023767114602862006-07-27HIGH VOLTAGE ELECTROSTATIC DISCHARGE PROTECTION DEVICES AND ELECTROSTATIC DISCHARGE PROTECTION CIRCUITS
2008-01-3120080023768114927012006-07-25Synchronous substrate injection clamp
2008-01-3120080023769117523702007-05-23Semiconductor Devices Having Selectively Tensile Stressed Gate Electrodes and Methods of Fabricating the Same
2008-01-3120080023770118237652007-06-28Stacked semiconductor devices and methods of manufacturing the same
2008-01-3120080023771116858472007-03-14SEMICONDUCTOR STRUCTURE COMPRISING FIELD EFFECT TRANSISTORS WITH STRESSED CHANNEL REGIONS AND METHOD OF FORMING THE SAME
2008-01-3120080023772118782942007-07-23Semiconductor device including a germanium silicide film on a selective epitaxial layer
2008-01-3120080023773116046942006-11-28Semiconductor device and method of manufacturing the same
2008-01-3120080023774118068812007-06-05Semiconductor device and method for fabricating the same
2008-01-3120080023775118712892007-10-12ASYMMETRIC FIELD EFFECT TRANSISTORS (FETs)
2008-01-3120080023776114932942006-07-25Metal oxide semiconductor device with improved threshold voltage and drain junction breakdown voltage and method for fabricating same
2008-01-3120080023777118668872007-10-03Semiconductor Device and Method of Manufacture Thereof
2008-01-3120080023778118303122007-07-30Fully Silicided Gate Electrodes and Method of Making the Same
2008-01-3120080023779118893652007-08-13Photoelectric conversion element
2008-01-3120080023780117000672007-01-31Image pickup device and method of manufacturing the same
2008-01-3120080023781118303152007-07-30PHOTODIODE AND MANUFACTURING METHOD OF THE SAME
2008-01-3120080023782118360802007-08-08PHOTO SENSOR AND FABRICATION METHOD THEREOF
2008-01-3120080023783114943512006-07-25Sensing capacitance in column sample and hold circuitry in a CMOS imager and improved capacitor design
2008-01-3120080023784118788332007-07-27Solid-state imaging apparatus
2008-01-3120080023785114958032006-07-28Bottom source LDMOSFET structure and method
2008-01-3120080023786114920392006-07-25Semiconductor structure of a high side driver and method for manufacturing the same
2008-01-3120080023787118293102007-07-27SEMICONDUCTOR DEVICE
2008-01-3120080023788116956902007-04-03FUSE BOX OF SEMICONDUCTOR DEVICE FORMED USING CONDUCTIVE OXIDE LAYER AND METHOD FOR FORMING THE SAME
2008-01-3120080023789118348412007-08-07REPROGRAMMABLE ELECTRICAL FUSE
2008-01-3120080023790114968742006-07-31Mixed-use memory array
2008-01-3120080023791118678782007-10-05HIGH PERFORMANCE INTEGRATED INDUCTOR
2008-01-3120080023792114606412006-07-28FILLER CAPACITOR WITH A MULTIPLE CELL HEIGHT
2008-01-3120080023793118783492007-07-24Semiconductor device
2008-01-3120080023794118292782007-07-27INTEGRATED CIRCUIT WITH BIPOLAR TRANSISTOR
2008-01-3120080023795119029782007-09-27Semiconductor devices and method of manufacturing them
2008-01-3120080023796118293972007-07-27SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2008-01-3120080023797117827262007-07-25SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
2008-01-3120080023798114923052006-07-25Memory cells with an anode comprising intercalating material and metal species dispersed therein
2008-01-3120080023799117726442007-07-02NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
2008-01-3120080023800118787132007-07-26Process for smoothening III-N substrates
2008-01-3120080023801118313622007-07-31METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INDLCUDING A SEMICONDUCTOR
2008-01-3120080023802117822662007-07-24SEMICONDUCTOR DEVICE HAVING A SCRIBELINE STRUCTURE FAVORABLE FOR PREVENTING CHIPPING
2008-01-3120080023803114961062006-07-31Method for forming vertical structures in a semiconductor device
2008-01-3120080023804118685172007-10-07HIGH-SPEED ELECTRICAL INTERCONNECTS AND METHOD OF MANUFACTURING
2008-01-3120080023805114601012006-07-26Array-Processed Stacked Semiconductor Packages
2008-01-3120080023806118682942007-10-05STRESS-FREE LEAD FRAME
2008-01-3120080023807118297932007-07-27DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE AND METHODS OF MANUFACTURE
2008-01-3120080023808116168352006-12-27CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME
2008-01-3120080023809116168372006-12-27CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME
2008-01-3120080023810118785102007-07-25Semiconductor device
2008-01-3120080023811115376252006-09-30STRUCTURE COMBINING AN IC INTEGRATED SUBSTRATE AND A CARRIER, AND METHOD OF MANUFACTURING SUCH STRUCTURE
2008-01-3120080023812118780842007-07-20Semiconductor package having passive component and semiconductor memory module including the same
2008-01-3120080023813114953632006-07-28Multi-die apparatus including moveable portions
2008-01-3120080023814118298512007-07-27STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE
2008-01-3120080023815118589422007-09-21INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME
2008-01-3120080023816117441892007-05-03Semiconductor package
2008-01-3120080023817118667952007-10-03COMPONENT PACKAGING APPARATUS, SYSTEMS, AND METHODS
2008-01-3120080023818118819662007-07-30Contact device for use in a power semiconductor module or in a disc-type thyristor
2008-01-3120080023819117823562007-07-24PACKAGE STRUCTURE HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN AND METHOD FOR FABRICATING THE SAME
2008-01-3120080023820118662392007-10-02BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME
2008-01-3120080023821118815462007-07-26Substrate structure integrated with passive components
2008-01-3120080023822118780162007-07-20Chip on flexible printed circuit type semiconductor package
2008-01-3120080023823119038622007-09-24Power delivery using an integrated heat spreader
2008-01-3120080023824114955052006-07-28Double-sided die
2008-01-3120080023825118309512007-07-31Multi-die DC-DC Boost Power Converter with Efficient Packaging
2008-01-3120080023826118509962007-09-06MOUNTING DEVICE FOR A SEMICONDUCTOR PACKAGE
2008-01-3120080023827114612082006-07-31SOLDER CONNECTOR STRUCTURE AND METHOD
2008-01-3120080023828114945942006-07-28Semiconductor device having bumps in a same row for staggered probing
2008-01-3120080023829114961112006-07-31Substrate and process for semiconductor flip chip package
2008-01-3120080023830116039092006-11-24Contact structure having a compliant bump and a testing area and manufacturing method for the same
2008-01-3120080023831116438362006-12-22Semiconductor device and manufacturing method for the same
2008-01-3120080023832117627292007-06-13CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF
2008-01-3120080023833118697872007-10-10SOLDER BUMPS IN FLIP-CHIP TECHNOLOGIES
2008-01-3120080023834118675272007-10-04Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate Electronic Circuit Board
2008-01-3120080023835117978512007-05-08Ohmic contact film in semiconductor device
2008-01-3120080023836117989912007-05-18Semiconductor device
2008-01-3120080023837118659872007-10-02METHOD FOR FABRICATING INTERCONNECT AND INTERCONNECT FABRICATED THEREBY
2008-01-3120080023838118780202007-07-20Manufacturing method of semiconductor device and semiconductor device
2008-01-3120080023839113899272006-03-27Molybdenum-based electrode with carbon nanotube growth
2008-01-3120080023840114612112006-07-31VIA HEAT SINK MATERIAL
2008-01-3120080023841118305052007-07-30MOUNTING BOARD, METHOD FOR MANUFACTURING MOUNTING BOARD, AND SEMICONDUCTOR MODULE
2008-01-3120080023842118388922007-08-15SEMICONDUCTOR DEVICE
2008-01-3120080023843118806692007-07-24Semiconductor device
2008-01-3120080023844118196282007-06-28Interconnection substrate, semiconductor chip package including the same, and display system including the same
2008-01-3120080023845118653952007-10-01LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES
2008-01-3120080023846118787962007-07-26Semiconductor device and manufacturing method of the same
2008-01-3120080023847119028262007-09-26Semiconductor device and its wiring method
2008-01-3120080023848119028272007-09-26Semiconductor device and its wiring method
2008-01-3120080023849114928772006-07-26Chip module
2008-01-3120080023850114933752006-07-26Silicon-based thin substrate and packaging schemes
2008-01-3120080023851114611482006-07-31MICROELECTRONIC DEVICE CONNECTION STRUCTURE
2008-01-3120080023852114956782006-07-31Metal pad of mode dial and manufacturing method thereof
2008-01-3120080023853118660652007-10-02FLIP CHIP ADAPTOR PACKAGE FOR BARE DIE
2008-01-3120080023854116632192005-09-23Generating an Integrated Circuit Identifier
2008-01-3120080023855118307822007-07-30OVERLAY MARKS, METHODS OF OVERLAY MARK DESIGN AND METHODS OF OVERLAY MEASUREMENTS
2008-01-3120080024036118321952007-08-01TRANSDUCER MEMBRANE WITH SYMMETRICAL CURVATURE
2008-01-3120080024037118801682007-07-20Piezo-electric substrate and manufacturing method of the same
2008-01-3120080024038118499562007-09-04Microfabricated Mechanical Frequency Multiplier
2008-01-3120080024039114925482006-07-25Micro-actuator, HGA equipped with the micro-actuator and method for manufacturing the HGA
2008-01-3120080024042116278582007-01-26THIN FILM PIEZOELECTRIC BULK ACOUSTIC WAVE RESONATOR AND RADIO FREQUENCY FILTER USING THE SAME
2008-01-3120080024043114961892006-07-31Strain tolerant metal electrode design
2008-01-3120080024054116614092005-08-30Organic Electroluminescent Device and Method for Producing the Same
2008-01-3120080024055117266242007-03-22Transparent conducting oxide thin films and related devices
2008-01-3120080024057118302502007-07-30ORGANIC LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
2008-01-3120080024059114602972006-07-27SYSTEM FOR DISPLAYING IMAGES INCLUIDNG ELECTROLUMINESCENT DEVICE AND METHOD FOR FABRICATING THE SAME
2008-01-3120080025360117805122007-07-20SEMICONDUCTOR LAYER STRUCTURE WITH SUPERLATTICE
2008-01-3120080025821114596552006-07-25OCTAGON TRANSFER CHAMBER
2008-01-3120080025823118288632007-07-26LOAD LOCK DEVICE, AND SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME
2008-01-3120080025824118795092007-07-18Wafer transfer apparatus and substrate transfer apparatus
2008-01-3120080026229115877022005-05-03Organic Electronic Devices
2008-01-3120080026249115060022006-08-17Electronic devices comprising organic iridium compositions
2008-01-3120080026250115070512006-08-18Electronic devices comprising organic iridium compositions
2008-01-3120080026251118264952007-07-16Insulating film formation method, semiconductor device, and substrate processing apparatus
2008-01-3120080026300118785802007-07-25Photomask manufacturing method and semiconductor device manufacturing method
2008-01-3120080026487116882802007-03-20METHOD OF FORMING AN ETCH INDICATOR LAYER FOR REDUCING ETCH NON-UNIFORMITIES
2008-01-3120080026488114957252006-07-31Method and apparatus for detecting endpoint in a dry etching system by monitoring a superimposed DC current
2008-01-3120080026489114958592006-07-28Method and system for modeling statistical leakage-current distribution
2008-01-3120080026490118268612007-07-19Evaluation method using a TEG, a method of manufacturing a semiconductor device having the TEG, an element substrate and a panel having the TEG, a program for controlling dosage and a computer-readable recording medium recording the program
2008-01-3120080026491115504262006-10-18METHOD OF WAFER SEGMENTING
2008-01-3120080026492116956572007-04-03METHOD OF REDUCING CONTAMINATION BY PROVIDING A REMOVABLE POLYMER PROTECTION FILM DURING MICROSTRUCTURE PROCESSING
2008-01-3120080026493117871082007-04-12Efficient method to predict integrated circuit temperature and power maps
2008-01-3120080026494114941812006-07-26Method of fabricating a terbium-doped electroluminescence device via metal organic deposition processes
2008-01-3120080026495114944292006-07-27Electromagnetic waveguide
2008-01-3120080026496116375822006-12-12Method of making organic light emitting devices
2008-01-3120080026497118260852007-07-12Manufacturing method of light-emitting element
2008-01-3120080026498114969182006-07-31Light emitting diode package element with internal meniscus for bubble free lens placement
2008-01-3120080026499117693012007-06-27METHOD FOR FORMING PATTERN, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY
2008-01-3120080026500117815182007-07-23FLAT PANEL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
2008-01-3120080026501118786642007-07-26Method of manufacturing a light emitting device
2008-01-3120080026502118701152007-10-10GROWTH OF NON-POLAR M-PLANE III-NITRIDE FILM USING METALORGANIC CHEMICAL VAPOR DEPOSITION (MOCVD)
2008-01-3120080026503114604592006-07-27On-Chip Sensor Array for Temperature Management in Integrated Circuits
2008-01-3120080026504119038732007-09-25Solid-state image pickup device and manufacturing method for the same
2008-01-3120080026505114948582006-07-28Electronic packages with roughened wetting and non-wetting zones
2008-01-3120080026506118683822007-10-05SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD
2008-01-3120080026507119052432007-09-28Stack package using anisotropic conductive film (ACF) and method of making same
2008-01-3120080026508118686242007-10-08Integrated Circuit Device Incorporating Metallurgical Bond to Enhance Thermal Conduction to a Heat Sink
2008-01-3120080026510118664032007-10-02NONVOLATILE MEMORY CELL COMPRISING A REDUCED HEIGHT VERTICAL DIODE
2008-01-3120080026511118203202007-06-19Semiconductor device and method for manufacturing thereof
2008-01-3120080026512118672132007-10-04INTEGRATED CIRCUIT CHIP WITH FETS HAVING MIXED BODY THICKNESSES AND METHOD OF MANUFACTURE THEREOF
2008-01-3120080026513114600102006-07-26METHOD AND STRUCTURE FOR SELF-ALIGNED DEVICE CONTACTS
2008-01-3120080026514118625652007-09-27METHOD FOR PRODUCING NITRIDE SEMICONDUCTOR DEVICE
2008-01-3120080026515114932292006-07-26Silicide block isolated junction field effect transistor source, drain and gate
2008-01-3120080026516114597302006-07-25RAISED STI STRUCTURE AND SUPERDAMASCENE TECHNIQUE FOR NMOSFET PERFORMANCE ENHANCEMENT WITH EMBEDDED SILICON CARBON
2008-01-3120080026517114607422006-07-28METHOD FOR FORMING A STRESSOR LAYER
2008-01-3120080026518114953482006-07-28Spacer layer etch method providing enhanced microelectronic device performance
2008-01-3120080026519118783512007-07-24Semiconductor devices and methods of fabricating the same
2008-01-3120080026520118680012007-10-05Semiconductor Method and Device with Mixed Orientation Substrate
2008-01-3120080026521118086642007-06-12Method for manufacturing a transistor of a semiconductor device
2008-01-3120080026522118672712007-10-04HIGH PERFORMANCE CMOS DEVICE STRUCTURES AND METHOD OF MANUFACTURE
2008-01-3120080026523114955082006-07-28Structure and method to implement dual stressor layers with improved silicide control
2008-01-3120080026524118684002007-10-05SEMICONDUCTOR DEVICE HAVING A WELL STRUCTURE FOR IMPROVING SOFT ERROR RATE IMMUNITY AND LATCH-UP IMMUNITY AND A METHOD OF MAKING SUCH A DEVICE
2008-01-3120080026525114944012006-07-26Semiconductor processing method and chemical mechanical polishing methods
2008-01-3120080026526114598372006-07-25METHOD FOR REMOVING NANOCLUSTERS FROM SELECTED REGIONS
2008-01-3120080026527114602162006-07-26AN APPARATUS AND ASSOCIATED METHOD FOR MAKING A FLOATING GATE MEMORY DEVICE WITH INCREASED GATE COUPLING RATIO
2008-01-3120080026528118671372007-10-04Non-volatile Memory Cell Array Having Discontinuous Source and Drain Diffusions Contacted by Continuous Bit Line Conductors and Methods of Forming
2008-01-3120080026529114607822006-07-28TRANSISTOR WITH ASYMMETRY FOR DATA STORAGE CIRCUITRY
2008-01-3120080026530114930282006-07-26Method of forming a doped portion of a semiconductor and method of forming a transistor
2008-01-3120080026531116842112007-03-09FIELD EFFECT TRANSISTOR AND METHOD OF FORMING A FIELD EFFECT TRANSISTOR
2008-01-3120080026532118501272007-09-05Nano-Enabled Memory Devices and Anisotropic Charge Carrying Arrays
2008-01-3120080026533116546662007-01-18Semiconductor device and manufacturing method thereof
2008-01-3120080026534118666272007-10-03SELF-ALIGNED PROCESS FOR NANOTUBE/NANOWIRE FETs
2008-01-3120080026536118705432007-10-11INTEGRATED PROCESS FOR THIN FILM RESISTORS WITH SILICIDES
2008-01-3120080026537118083382007-06-08Method for forming capacitor of semiconductor device
2008-01-3120080026538118660392007-10-02METHODS OF FORMING CAPACITORS FOR SEMICONDUCTOR MEMORY DEVICES AND RESULTING SEMICONDUCTOR MEMORY DEVICES
2008-01-3120080026539118781722007-07-20Capacitance element manufacturing method and etching method
2008-01-3120080026540114926492006-07-25Integration for buried epitaxial stressor
2008-01-3120080026541114600192006-07-26AIR-GAP INTERCONNECT STRUCTURES WITH SELECTIVE CAP
2008-01-3120080026542118287932007-07-26Method of Manufacturing Semiconductor Device
2008-01-3120080026543118812852007-07-25Method of manufacturing semiconductor device
2008-01-3120080026544115952322006-11-10Method for improving the quality of an SiC crystal and an SiC semiconductor device
2008-01-3120080026545114949692006-07-28Integrated devices on a common compound semiconductor III-V wafer
2008-01-3120080026546118293852007-07-27CRYSTAL GROWTH METHOD AND REACTOR DESIGN
2008-01-3120080026547117137382007-03-05Method of forming poly-si pattern, diode having poly-si pattern, multi-layer cross point resistive memory device having poly-si pattern, and method of manufacturing the diode and the memory device
2008-01-3120080026548115477242005-03-29Film Forming Apparatus and Film Forming Method
2008-01-3120080026549118308302007-07-30METHODS OF CONTROLLING MORPHOLOGY DURING EPITAXIAL LAYER FORMATION
2008-01-3120080026550116273722007-01-25Laser doping of solid bodies using a linear-focussed laser beam and production of solar-cell emitters based on said method
2008-01-3120080026551118302772007-07-30FORMATION OF FULLY SILICIDED METAL GATE USING DUAL SELF-ALIGNED SILICIDE PROCESS
2008-01-3120080026552117736312007-07-05METHOD OF ENHANCING LITHOGRAPHY CAPABILITIES DURING GATE FORMATION IN SEMICONDUCTORS HAVING A PRONOUNCED SURFACE TOPOGRAPHY
2008-01-3120080026553114964112006-07-31Method for fabricating an integrated gate dielectric layer for field effect transistors
2008-01-3120080026554114600112006-07-26INTERCONNECT STRUCTURE FOR BEOL APPLICATIONS
2008-01-3120080026555114943892006-07-26Sacrificial tapered trench opening for damascene interconnects
2008-01-3120080026556114962912006-07-31Barrier process/structure for transistor trench contact applications
2008-01-3120080026557118689122007-10-10ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATION
2008-01-3120080026558118891842007-08-09Pad structure for liquid crystal display and method of manufacturing thereof
2008-01-3120080026559118674662007-10-04Solder Ball Pad Structure
2008-01-3120080026560118687852007-10-08METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS AND RELATED STRUCTURES
2008-01-3120080026561114599902006-07-26METHODS OF TRENCH AND CONTACT FORMATION IN MEMORY CELLS
2008-01-3120080026562118674442007-10-04Novel Metallization Scheme and Method of Manufacture Therefor
2008-01-3120080026563118634032007-09-28SEMICONDUCTOR DEVICE MANUFACTURING DEVICE
2008-01-3120080026564116783242007-02-23METHOD OF FORMING AN ELECTRICALLY CONDUCTIVE LINE IN AN INTEGRATED CIRCUIT
2008-01-3120080026565118276872007-07-13Method of manufacturing a composite of copper and resin
2008-01-3120080026566118476572007-08-30DUAL DAMASCENE INTERCONNECT STRUCTURES HAVING DIFFERENT MATERIALS FOR LINE AND VIA CONDUCTORS
2008-01-3120080026567118690442007-10-09INCREASING ELECTROMIGRATION LIFETIME AND CURRENT DENSITY IN IC USING VERTICALLY UPWARDLY EXTENDING DUMMY VIA
2008-01-3120080026568114611372006-07-31INTERCONNECT STRUCTURE AND PROCESS OF MAKING THE SAME
2008-01-3120080026569118684352007-10-05Advanced Seed Layers for Interconnects
2008-01-3120080026570117714862007-06-29METHOD OF FORMING A METAL LINE OF A SEMICONDUCTOR MEMORY DEVICE
2008-01-3120080026571118426112007-08-21Bit Line Barrier Metal Layer for Semiconductor Device and Process for Preparing the Same
2008-01-3120080026572117461062007-05-09METHOD FOR FORMING A STRAINED TRANSISTOR BY STRESS MEMORIZATION BASED ON A STRESSED IMPLANTATION MASK
2008-01-3120080026573117829292007-07-25METHOD OF PRODUCING ACTIVE MATRIX SUBSTRATE
2008-01-3120080026574118350672007-08-07METHOD AND APPARATUS OF DISTRIBUTED PLASMA PROCESSING SYSTEM FOR CONFORMAL ION STIMULATED NANOSCALE DEPOSITION PROCESS
2008-01-3120080026575114953352006-07-28Dispenser system for atomic beam assisted metal organic chemical vapor deposition (MOCVD)
2008-01-3120080026576115400712006-09-29Organometallic compounds
2008-01-3120080026577115429232006-10-04Organometallic compounds
2008-01-3120080026578115400722006-09-29Organometallic compounds
2008-01-3120080026579114599312006-07-25COPPER DAMASCENE PROCESS
2008-01-3120080026580117829712007-07-25Method For Forming Copper Metal Lines In Semiconductor Integrated Circuit Devices
2008-01-3120080026581114610802006-07-31FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES FORMED THEREON
2008-01-3120080026582118685382007-10-08PLANARIZATION PROCESS FOR PRE-DAMASCENE STRUCTURE INCLUDING METAL HARD MASK
2008-01-3120080026583118393292007-08-15COMPOSITIONS AND METHODS FOR MODIFYING A SURFACE SUITED FOR SEMICONDUCTOR FABRICATION
2008-01-3120080026584114923162006-07-25LPCVD gate hard mask
2008-01-3120080026585118123932007-06-19Composition for removing a film, method of removing a film using the same, and method of forming a pattern using the same
2008-01-3120080026586115957272006-11-10Phase change memory cell and method and system for forming the same
2008-01-3120080026587117809702007-07-20SEMICONDUCTOR DEVICE
2008-01-3120080026588118820472007-07-30Method of forming inductor in semiconductor device
2008-01-3120080026589118786172007-07-25Electrode for plasma processes and method for manufacture and use thereof
2008-01-3120080026590114941412006-07-26Metal organic deposition precursor solution synthesis and terbium-doped SiO2 thin film deposition
2008-01-3120080026591118293752007-07-27SINTERED METAL COMPONENTS FOR CRYSTAL GROWTH REACTORS
2008-01-3120080026592118688982007-10-08MULTILAYER SUBSTRATE
2008-01-3120080026593105879122004-10-01Method and Apparatus for the Manufacture of Electric Circuits
2008-01-3120080026594116290582005-06-08Reduction of Cracking in Low-K Spin-On Dielectric Films
2008-01-3120080026595118705642007-10-11METHOD OF FORMING AN INTEGRATED CIRCUIT HAVING A DEVICE WAFER WITH A DIFFUSED DOPED BACKSIDE LAYER
2008-01-3120080026596118128822007-06-22Method of forming metallic oxide films using atomic layer deposition
2008-01-3120080026597117539182007-05-25METHOD FOR DEPOSITING AND CURING LOW-K FILMS FOR GAPFILL AND CONFORMAL FILM APPLICATIONS
2008-01-3120080026598114933592006-07-26Semiconductor manufacturing device and method
2008-01-3120080026599114607482006-07-28TRANSFER OF STRESS TO A LAYER
2008-01-3120080027525118670222007-10-04Electrode Structure